Ruthenium Paste For Thick Film Circuits
MANA-PR-Ru-4500 Series is mainly used in the production and preparation of thick film circuits and related separated components.
Product Properties:
1. Physical Properties
| Grade | MANA-PR-Ru-4500 Series | ||||||
| Solid Content | 70-80% | ||||||
| Particle Size(um) | ≤10 | ||||||
| Viscosity(Pa S) | 500±100 | ||||||
| Benchmarking: | |||||||
| Performance | 4511 | 4521 | 4531 | 4541 | 4551 | 4561 | 4571 |
| Electrical Resistivity (Ω/□）±15% | 10 | 100 | 1K | 10K | 100K | 1M | 10M |
| Temperature Coefficient of Resistance（PPM/℃） | ±100 | ±100 | ±100 | ±100 | ±100 | ±100 | ±100 |
| Temperature Coefficient of Resistance（V/mm） | 2.8 | 8.84 | 28 | 88 | 280 | 400 | 400 |
| Dipping Solder(△R%) | ±0.5 | ±0.5 | ±0.5 | ±0.5 | ±0.5 | ±0.5 | ±0.5 |
| Noise(dB) | <-25 | -20 | -10 | -5 | -5 | 0 | 0 |
| Room Temperature Storage(25℃、1000h、△R%） | ±0.5 | ±0.5 | ±0.5 | ±0.5 | ±0.5 | ±0.5 | ±0.5 |
| Hot Flash test（△R%）40℃、94%RH 250h ） | ±0.5 | ±0.5 | ±0.5 | ±0.5 | ±0.5 | ±0.5 | ±0.5 |
| Thermal Stability （△R%）150℃、250h） | ±0.5 | ±0.5 | ±0.5 | ±0.5 | ±0.5 | ±0.5 | ±0.5 |
| Temperature Cycle（△R%）-55℃-125℃、5times） | ±0.2 | ±0.2 | ±0.2 | ±0.2 | ±0.2 | ±0.2 | ±0.2 |
Recommended Using Process:
1. Stirring: Gently stir well before use.
2. Recommended Printing Thickness: 20±2µm
3. Mesh Material And Mesh: nylon mesh inch 250-300 mesh
Stainless Steel Wire Mesh: Inch 260-325 Mesh
4. Drying: After printing, place it in a 150℃ oven or under an infrared light for 15 minutes.
5. Sintering Process (Recommended): Sintering in tunnel furnace, sintering peak temperature 850℃, peak
Value holding time 10 minutes, sintering cycle 45-60 minutes.
Attention:
1. Safe use: The paste is harmful if swallowed, inhaled or in contact with the skin, so use wash thoroughly immediately after, avoid contact with eyes, skin or clothing, keep away tinder or burning material. Because it is flammable, cover it tightly when not in use to avoid inhalation of volatilization gas, keep air circulation when using.
2. This paste is a ready-to-use product and does not need to be diluted. If it needs to be diluted, the amount added should not exceed
3% (weight ratio), too much diluent will directly affect the performance of the slurry.
3. The thickness of the printed circuit itself should not be less than 4μm, otherwise the electrical conductivity will be unstable.
4. This slurry should be stored in a cool and dry place between 4~25℃.
5. Storage period: The original package is sealed for six months.
Technological process
Production Platform:
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