Silver Platinum Paste For Thick Film Hybrid Integrated Circuit
MANA-AgPt-6110 is applicable to the introduction line of thick film hybrid integrated circuit production to produce thick film conductor and conductor of glass glaze potentiometer terminal.
Product Properties:
1. Characteristics: Lead-free, cadmium-free, high temperature sintering, high conductivity, extremely resistant to 96% alumina ceramic substrates good adhesion.
2. Physical Properties
| Grade | MANA-AgPt-6110 |
| Solid Content | 78-82 |
| Particle Size(um) | ≤10 |
| Viscosity(Pa S) | 250-350 |
Benchmarking:
| MANA-AgPt-6110 | |
| Printing resolution/µm | 125×125 |
| Sheet resistance/mΩ/□ | <10 |
| Sintering thickness/µm | 10~15 |
| Solderability (220℃±5℃) | GOOD |
| Peel adhesion( N/2 × 2mm2) | >40 |
Recommended Using Process:
1. Screen Mesh/Emulsion: 200~300 Mesh/25µm
2. Leveling Time: (25℃)5~10minutes
3. Drying: 125℃/10~15minutes
4. Firing Temperature: 850℃±10℃
5. Time At Peak: 10~12minutes
6. Rate Of Ascent/Descent: 60~100℃/minutes
7. Total Cycle: 45~60minutes
8. Substrate Of Calibration: 96%alumina
Attention:
1. Safe use: The paste is harmful if swallowed, inhaled or in contact with the skin, so use wash thoroughly immediately after, avoid contact with eyes, skin or clothing, keep away tinder or burning material. Because it is flammable, cover it tightly when not in use to avoid inhalation of volatilization gas, keep air circulation when using.
2. This paste is a ready-to-use product and does not need to be diluted. If it needs to be diluted, the amount added should not exceed
3% (weight ratio), too much diluent will directly affect the performance of the slurry.
3. The thickness of the printed circuit itself should not be less than 4μm, otherwise the electrical conductivity will be unstable.
4. This slurry should be stored in a cool and dry place between 4~25℃.
5. Storage period: The original package is sealed for six months.
Production Platform:
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