Low temperature sintered conductive
Mana-Ag-9801C silver paste is a low temperature semi sintering system. It has excellent damp heat resistance and chemical stability. It has low temperature sintering function, fast drying rate, good sintering compactness, good thermal conductivity, conductivity and thermal cycle reliability. The product is lead-free, chromium free and mercury free, and complies with ROHS regulations.
In recent years, nano-Ag particle sintered silver paste has shown good application prospects in electronic packaging. Most of this type of silver paste is fully sintered, and the main components are usually nano-scale Ag particles, micron-scale Ag particles, and organic solvents such as dispersants. Its viscosity, thixotropic index and other properties are not much different from those of ordinary conductive silver paste, and the existing wafer-level fully automatic mounting equipment and curing equipment can be used. After sintering, the organic solvent decomposes and volatilizes, and the connecting layer is almost pure silver, with high thermal conductivity, good conductivity, excellent corrosion resistance and creep resistance. However, studies have found that Ag nanoparticles are prone to electrochemical migration, and when the silver sintered layer is in service at high temperature for a long time, the organization is prone to pore aggregation and failure; for the gold-plated interface, even if the initial performance of the connecting layer is excellent, due to the strong mutual diffusion between Ag-Au, the performance will rapidly decline during long-term high-temperature service. In order to improve the reliability of long-term high-temperature service, we have developed a semi-sintered silver paste and increased the epoxy resin content, so that its performance and sintered state are between the fully sintered silver paste and the ordinary conductive silver paste.
Main Features
Strong process adaptability meets the requirements of spot coating
Excellent moisture and heat resistance and chemical stability
Low temperature sintering, fast drying and dense sintering
Technical Data
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Project |
PC-Ag-9801C |
Remarks |
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Tone and Shape |
Silver gray medium viscous |
Visual inspection |
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Viscosity |
12 Pa·S |
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Fineness |
≤10μm |
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Solid Content |
87±2 |
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Curing Conditions |
150℃×10 mins |
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Sintering Condition |
350℃×30 mins |
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Sheet Resistance |
˂5 mΩ/□ |
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Drawing Force |
>50 N |
Gold-plated substrate |
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The above test technical data are based on the laboratory test results, which are only for customers' reference, and cannot fully guarantee all the data that can be achieved in a specific environment. |
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Instructions and Notes
1. As the curing and sintering process temperature of silver paste depends on the substrate material and adhesive layer thickness, please refer to the above "Technical Data" for the selection of curing and sintering conditions.
2. Silver paste contains volatile solvent. After use, please use cellulose solvent, ester or ketone solvent for cleaning; In the process of using silver paste, please use silver paste in a well ventilated environment, and wear necessary protective equipment, such as protective clothing, PE gloves, activated carbon masks, goggles, etc.
3. The storage temperature of silver paste should not be higher than+30°C, which will cause irreversible changes in the properties of silver paste.
4. Do not expose the whole bottle of silver paste to the air for a long time. Please feel free to contact us if you have any questions.
Technological process
Production Platform:
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