Strong Adhesion Palladium Silver Conductor Paste for Thick Film Circuit

All we do is always associated with our tenet 'Customer first, Trust first', devoting on the food packaging and environmental protection for Silver Powder, Cobalt Based Alloy Powder, CuSn10 Brazing Filler Metal. The company will continue to invest in equipment updates and personnel training, strive for technological innovation, and strengthen company management. The enthusiasm and innovation of our team provide a constant impetus for the development of the company. We own complete product specifications with stable quality, and a wide range of product sales.

Thick film conductive paste generally consists of three main components: functional phase, bonding phase and organic carrier. The functional phase determines the conductivity of the slurry and affects the physical and mechanical properties of the film. In conductive pastes, the functional phases are generally metals, alloys or mixtures thereof. The role of the bonding phase is to make the film and matrix firmly combined, usually glass, oxide crystal or their mixture as the bonding phase, the choice of bonding phase has a certain effect on the mechanical and electrical properties of the film. Organic carrier is a solution formed by polymer dissolved in organic solvent. It is the carrier of functional phase and bonded phase particles. It can control the rheological properties of slurry and make it suitable for screen printing.

The properties of thick film conductive paste vary according to different applications, usually including adhesion strength, weldability (wettability); In addition, the paste is required to have good technology, such as thixotropy, printing reproducibility and sintering. The composition of slurry, the ratio of each phase and the preparation method of slurry are the key factors to determine the above properties.

Product Parameters

Product Parameters

* Remark:Supporting customized according to customer requirements

Product Feature

*Lead-free,chromium-free,mercury-free,RoHS compliang.

*Excellent printability,conductivity and adhesion strength.

*Good weather resistance and chemical stability.

*The resistance value can be adjusted arbitrarily with the same series of silver pastes.

Application

It is suitable for thick film hybrid integrated circuit, lead and electrode of separated components, internal connection and end lead of circuit made by medium temperature firing, electrode of semiconductor ceramic devices, Environmental protection paste, special circuit on the AL2O3 ceramic substrate internal connection and end lead wire, ceramic device electrode, etc

Technological process

Production Platform:

FAQ

1. Who are we?

We are based in Hunan, China, our product sell to Asia, Europe, America, North America and Southeast Asia, and we are fully capable of undertaking global business. There are total about 101-200 people in our factory

2. How can we guarantee quality?

Always a pre-production sample before mass production;

Always final Inspection before shipment;

3.What can you buy from us?

3D printing metal powder ,MIM powder, Brazing powder&paste, Electronic paste, the products included are 316L,17-4ph,H13,FeSiAl,Inconel718,Inconel625, Silver based filler metal, Copper based filler metal, Nickel based filler metal, Silver paste,Rare earth products.

Success comes from the heart, we are tirelessly committed to creating more excellent Strong Adhesion Palladium Silver Conductor Paste for Thick Film Circuit and broad market for customers. We take safety and efficiency as the management objectives, strengthen the bottom line principle, establish and improve the safety management system and risk prevention and control mechanism. We meet customer needs in terms of innovation, practicality and convenience of products and services.