Pd/AG Palladium Silver Paste for Thick Film Circuit

We have always been committed to becoming one of the professional manufacturers in the Inconel 625 Powder, Bismuth Oxide Powder, BNi 7 Brazing Filler Metal industry. We hope to enhance our employees' sense of belonging, progress, and achievement so as to improve the operational efficiency of the company and achieve a win-win situation for all stakeholders. We integrate development and design, manufacturing, market development and after-sales service to meet the different needs of our customers. We are looking forward to forming successful business relationship with customers all over the world. Our company is fortunate to have created noteworthy performance for the country and society with your care and support.

Thick film conductive paste generally consists of three main components: functional phase, bonding phase and organic carrier. The functional phase determines the conductivity of the slurry and affects the physical and mechanical properties of the film. In conductive pastes, the functional phases are generally metals, alloys or mixtures thereof. The role of the bonding phase is to make the film and matrix firmly combined, usually glass, oxide crystal or their mixture as the bonding phase, the choice of bonding phase has a certain effect on the mechanical and electrical properties of the film. Organic carrier is a solution formed by polymer dissolved in organic solvent. It is the carrier of functional phase and bonded phase particles. It can control the rheological properties of slurry and make it suitable for screen printing.

The properties of thick film conductive paste vary according to different applications, usually including adhesion strength, weldability (wettability); In addition, the paste is required to have good technology, such as thixotropy, printing reproducibility and sintering. The composition of slurry, the ratio of each phase and the preparation method of slurry are the key factors to determine the above properties.

Product Parameters

Product Parameters

* Remark:Supporting customized according to customer requirements

Product Feature

*Lead-free,chromium-free,mercury-free,RoHS compliang.

*Excellent printability,conductivity and adhesion strength.

*Good weather resistance and chemical stability.

*The resistance value can be adjusted arbitrarily with the same series of silver pastes.

Application

It is suitable for thick film hybrid integrated circuit, lead and electrode of separated components, internal connection and end lead of circuit made by medium temperature firing, electrode of semiconductor ceramic devices, Environmental protection paste, special circuit on the AL2O3 ceramic substrate internal connection and end lead wire, ceramic device electrode, etc

Technological process

Production Platform:

FAQ

1. Who are we?

We are based in Hunan, China, our product sell to Asia, Europe, America, North America and Southeast Asia, and we are fully capable of undertaking global business. There are total about 101-200 people in our factory

2. How can we guarantee quality?

Always a pre-production sample before mass production;

Always final Inspection before shipment;

3.What can you buy from us?

3D printing metal powder ,MIM powder, Brazing powder&paste, Electronic paste, the products included are 316L,17-4ph,H13,FeSiAl,Inconel718,Inconel625, Silver based filler metal, Copper based filler metal, Nickel based filler metal, Silver paste,Rare earth products.

Our ambitious goal is to become a flagship in the Pd/AG Palladium Silver Paste for Thick Film Circuit industry and make outstanding contributions to society. Advanced manufacturing technology, high-quality product quality, professional production workers, and timely after-sales service are the basis for us to ensure customer's satisfaction. The company has long-term in-depth cooperation with major well-known brands and companies to serve customers in various industries.