Pd/AG Palladium Silver Conductor Paste for Thick Film Circuit

We will adhere to high-quality products and high-level services, and invest more capital and technology to research and develop Flake Silver Powder, Spherical Silver Powder, CuZn45 Brazing Filler Metal to meet customer needs and improve our marketing and service network. We tale the principle of "our service has no starting point and satisfaction has no end point". We strive to create a good working environment for each employee and mobilize all positive factors to the maximum extent. Realizing industrial automation can improve system performance and labor conditions, reduce labor intensity, greatly increase productivity, save energy, and improve product quality and economic benefits.

Thick film conductive paste generally consists of three main components: functional phase, bonding phase and organic carrier. The functional phase determines the conductivity of the slurry and affects the physical and mechanical properties of the film. In conductive pastes, the functional phases are generally metals, alloys or mixtures thereof. The role of the bonding phase is to make the film and matrix firmly combined, usually glass, oxide crystal or their mixture as the bonding phase, the choice of bonding phase has a certain effect on the mechanical and electrical properties of the film. Organic carrier is a solution formed by polymer dissolved in organic solvent. It is the carrier of functional phase and bonded phase particles. It can control the rheological properties of slurry and make it suitable for screen printing.

The properties of thick film conductive paste vary according to different applications, usually including adhesion strength, weldability (wettability); In addition, the paste is required to have good technology, such as thixotropy, printing reproducibility and sintering. The composition of slurry, the ratio of each phase and the preparation method of slurry are the key factors to determine the above properties.

Product Parameters

Product Parameters

* Remark:Supporting customized according to customer requirements

Product Feature

*Lead-free,chromium-free,mercury-free,RoHS compliang.

*Excellent printability,conductivity and adhesion strength.

*Good weather resistance and chemical stability.

*The resistance value can be adjusted arbitrarily with the same series of silver pastes.

Application

It is suitable for thick film hybrid integrated circuit, lead and electrode of separated components, internal connection and end lead of circuit made by medium temperature firing, electrode of semiconductor ceramic devices, Environmental protection paste, special circuit on the AL2O3 ceramic substrate internal connection and end lead wire, ceramic device electrode, etc

Technological process

Production Platform:

FAQ

1. Who are we?

We are based in Hunan, China, our product sell to Asia, Europe, America, North America and Southeast Asia, and we are fully capable of undertaking global business. There are total about 101-200 people in our factory

2. How can we guarantee quality?

Always a pre-production sample before mass production;

Always final Inspection before shipment;

3.What can you buy from us?

3D printing metal powder ,MIM powder, Brazing powder&paste, Electronic paste, the products included are 316L,17-4ph,H13,FeSiAl,Inconel718,Inconel625, Silver based filler metal, Copper based filler metal, Nickel based filler metal, Silver paste,Rare earth products.

We strive to improve the safety of our Pd/AG Palladium Silver Conductor Paste for Thick Film Circuit and protect the health and safety of our customers. We will be recognized as a leading brand for our innovative and leading-edge processes, trusted quality strength, and active social responsibility. Our company integrates research, design, manufacturing, sales and service, and constantly seeks technological progress and product innovation.