Non-Toxic Element Ceramic Substrates for Thick Film Conductive Paste

According to different customer feedback, we will keep improving and constantly improve our 17 4PH Stainless Steel Metal Powder for MIM, Nickel Based Alloy Powder, Refractory Metal Powder. Quality-oriented, service first, we will cooperate sincerely with you! The company has always taken "Quality Assurance, Professional Service, Customer Satisfaction" as its business tenet, and "seeking benevolence as the greatest, seeking profit as the small, and truly serving the people" as its business philosophy, pioneering, enterprising, pragmatic and innovative. Sincerely thank our customers for their continued support and love to our products and various activities.

Thick film conductive paste generally consists of three main components: functional phase, bonding phase and organic carrier. The functional phase determines the conductivity of the slurry and affects the physical and mechanical properties of the film. In conductive pastes, the functional phases are generally metals, alloys or mixtures thereof. The role of the bonding phase is to make the film and matrix firmly combined, usually glass, oxide crystal or their mixture as the bonding phase, the choice of bonding phase has a certain effect on the mechanical and electrical properties of the film. Organic carrier is a solution formed by polymer dissolved in organic solvent. It is the carrier of functional phase and bonded phase particles. It can control the rheological properties of slurry and make it suitable for screen printing.

The properties of thick film conductive paste vary according to different applications, usually including adhesion strength, weldability (wettability); In addition, the paste is required to have good technology, such as thixotropy, printing reproducibility and sintering. The composition of slurry, the ratio of each phase and the preparation method of slurry are the key factors to determine the above properties.

Product Parameters

Product Parameters

* Remark:Supporting customized according to customer requirements

Product Feature

*Lead-free,chromium-free,mercury-free,RoHS compliang.

*Excellent printability,conductivity and adhesion strength.

*Good weather resistance and chemical stability.

*The resistance value can be adjusted arbitrarily with the same series of silver pastes.

Application

It is suitable for thick film hybrid integrated circuit, lead and electrode of separated components, internal connection and end lead of circuit made by medium temperature firing, electrode of semiconductor ceramic devices, Environmental protection paste, special circuit on the AL2O3 ceramic substrate internal connection and end lead wire, ceramic device electrode, etc

Technological process

Production Platform:

FAQ

1. Who are we?

We are based in Hunan, China, our product sell to Asia, Europe, America, North America and Southeast Asia, and we are fully capable of undertaking global business. There are total about 101-200 people in our factory

2. How can we guarantee quality?

Always a pre-production sample before mass production;

Always final Inspection before shipment;

3.What can you buy from us?

3D printing metal powder ,MIM powder, Brazing powder&paste, Electronic paste, the products included are 316L,17-4ph,H13,FeSiAl,Inconel718,Inconel625, Silver based filler metal, Copper based filler metal, Nickel based filler metal, Silver paste,Rare earth products.

We actively help to upgrade the Non-Toxic Element Ceramic Substrates for Thick Film Conductive Paste industry, lead the industry innovation, and become the outstanding model of this industry worldwide! Our company has set up for several years and we have fully utilized our resources in many aspects to develop the technology to cope with our business. We coordinate the operation between departments, so that there is no decoupling in the process and complete customer orders efficiently.